SurFx Atmospheric Plasma Cleaning/Activation System

  • Standalone/in-line atmospheric plasma platform
  • Suitable for PCBs, Thick Film Hybrids, Lead Frames, dies in waffle pack, JEDEC tray or gel-pack
  • Removal of oxidation from Copper lead frames before die / wire bonding
  • Process area up to 350 x 475 mm
  • Process gases – Ar,O2, N2, H2
  • Compact footprint


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