Semiconductor
MOT Wafer Electroplating / TSV Fill System
- Modular system ideal for industrial or R & D application
- Suitable for MEMS, Semicon. TSV Fill, Pillar, Wafer Chip Scale Package
- Wafer Size up to 300 mm
- Plating module for materials like Ni, Au, Cu, Ag, In and alloy like NiFe, NiCo, NiW, SnPb……
- Available as rack platter, Fountain tower, or flow channels (tilted wafer rotation)
- Pulse & reverse plating with minimum pulse time 0.2 msec. Optional complex wave forms like Sinus, Triangle etc
- PLC controlled
- Touch panel for easy operation