MOT Wafer Electroplating / TSV Fill System

  • Modular system ideal for industrial or R & D application
  • Suitable for MEMS, Semicon. TSV Fill, Pillar, Wafer Chip Scale Package
  • Wafer Size up to 300 mm
  • Plating module for materials like Ni, Au, Cu, Ag, In and alloy like NiFe, NiCo, NiW, SnPb……
  • Available as rack platter, Fountain tower, or flow channels (tilted wafer rotation)
  • Pulse & reverse plating with minimum pulse time 0.2 msec. Optional complex wave forms like Sinus, Triangle etc
  • PLC controlled
  • Touch panel for easy operation


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