Plasma Resist Ashing / Descum System

  • Microwave (2.45Ghz) damage-free Plasma process
  • Suitable for removal of photoresist after high dose implant or dry etching, descum, and wafer/substrate cleaning
  • Suitable for Silicon, III/IV compounds, Quartz, Ceramic, Lithium Niobate, Copper Interconnection devices etc..
  • SU-8 removal using Cooling plate
  • Mass flow controller (MFC) for gases like O2, N2,Ar,CF4…
  • End Point detection
  • PC based controller, user password, recipe storage


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