Plasma Resist Ashing / Descum System
- Microwave (2.45Ghz) damage-free Plasma process
- Suitable for removal of photoresist after high dose implant or dry etching, descum, and wafer/substrate cleaning
- Suitable for Silicon, III/IV compounds, Quartz, Ceramic, Lithium Niobate, Copper Interconnection devices etc..
- SU-8 removal using Cooling plate
- Mass flow controller (MFC) for gases like O2, N2,Ar,CF4…
- End Point detection
- PC based controller, user password, recipe storage