PacTech Solder Ball Attachment

Various solder deposition technologies to form solder bump for WLCSP and flip chip interconnects.

  • Automatic / Semi-automatic Solder Ball attachment and Laser Reflow
  • Highly Flexible
  • Vision and Pattern recognition
  • Selection of solder alloys
  • After attachment 2D inspection
  • Laser Repair /Rework / Reballing



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