PacTech Electroless NiAu/NiPd/NiPdAu Plating

PacTech offers several different pad finish and layer thickness on wafer furnace using electroless nickel plating in combination with electroless palladium and immersion gold process

• Low cost high reliability interface
• Maskless Process
• Manual / Fully automatic, dry-in dry-out
• In-line temperature, Ph, flow control
• Automatic Chemical Delivery and drain system
• SECS/GEM interface
• CN/CN free chemical option