PacTech Electroless NiAu/NiPd/NiPdAu Plating

PacTech offers several different pad finish and layer thickness on wafer furnace using electroless nickel plating in combination with electroless palladium and immersion gold process

  • Low cost high reliability interface
  • Maskless Process
  • Manual / Fully automatic, dry-in dry-out
  • In-line temperature, Ph, flow control
  • Automatic Chemical Delivery and drain system
  • SECS/GEM interface
  • CN/CN free chemical option


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